XLamp® XP-G4 LEDs are are the fourth generation of Cree LED’s standard-setting XP-G product family, featuring both best‑in‑class efficacy and optical performance. New features in this generation include a higher maximum drive current of 3000 mA and an optimized optical profile that maximizes on‑axis light output.

With the same mechanical dimensions as XP-G3, the XP-G4 is an easy upgrade path for many high‑power LED designs. XP-G4 provides higher maximum current and lower thermal resistance than competing high‑power LEDs, enabling new levels of output and reliability for many lighting applications.


  • Available in no CRI minimum white, 70-, 80- and 90-CRI white
  • 3-step and 5-step options
  • Binned at 85 °C
  • Maximum drive current: 3000 mA
  • Low thermal resistance: 1.3 °C/W
  • Wide viewing angle: 115
  • Unlimited floor life at < 30 °C/85% RH
  • Reflow solderable – JEDEC J-STD-020C
  • Electrically neutral thermal path
  • RoHS and REACH compliant

Need help choosing which LEDs work best for your design?

WPGA’s Innovation Technical Center (ITC) has a team of highly trained engineers that can recommend the best solution for your needs.


XLamp XP-G4 LEDs are optimized for a wide range of directional lighting
applications where lighting control and long lifetime are critical including:

  • Outdoor
  • Indoor premium
  • Architectural
  • Portable
  • Entertainment


Characteristics Unit Minimum Typical Maximum
Thermal resistance, junction to solder point °C/W 1.3
Viewing angle (FWHM) degrees 120
Temperature coefficient of voltage mV/ °C -1.3
ESD withstand voltage (HBW per Mil-Std-8830) Class 3B
DC Forward current mA 3000
Reverse voltage V 5
Forward voltage (@ 700 mA 85 °C) V 2.8 3.3
Forward voltage (@ 1000 mA, 85 °C)


Forward voltage (@2000 mA, 85 °C) V 3.14
Forward voltage (@ 3000 mA, 85 °C) V 3.32
CRI R9 (70 CRI minimum) -40
CRI R9 (80 CRI minimum) 0
CRI R9 (90 CRI minimum) 50
LED junction temperature °C 150

Thermal resistance measurement was performed per the JEDIC JESD51- JESD51-14 standard.